Job Description

Top 5 Required Skills:

1. 12+ years actively involved in PWB design for high-density electronics packaging.

2. 10+ years' experience in a PWB design role designing consumer-grade mobile products or low volume test products utilizing latest generation processor chips & ICs.

3. Design for Manufacture (DFM) analysis experience utilizing Valor (manager stated Valor is a key tool) and/or CAM350 tools.

4. Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages

5. Experience working include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem, Auto, Compute, Infrastructure and IOT

Education Requirement

• Associate's degree in a Technical Field, Electronics preferred

Keywords

• PWB (could be listed as PCB Designer), RF, radio circuits as well as power control devices.

• Preferred design experience: RF, Analog, High-speed digital circuits - DDR2, 3 & 4, LPDDR5, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE

Technologies

• Siemens/Mentor Xpedition (primary tool),

• PADS and / or Cadence Allegro PWB design software, Altium support

Min. Years of Experience Requirement

• 5-25 years

Job Overview

Company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

Role / Skills / Exp The successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to design and document printed wiring board layouts that conform to manufacturing and industry standards and client design guidelines. Working in close coordination with electrical and mechanical design teams from supplied schematics and electrical and mechanical design constraints to develop PWB layouts that meet all project goals and requirements for a variety of new 5G & 6G designs across multiple business units (R&D, Mobile, Compute, IOT, Infrastructure, Automotive, Test Equipment).

For example:

Reference Auto, Mobile, Infrastructure, IOT & Compute designs - 'form factor accurate' (FFA) test platform high volume circuit boards. These boards require mastery in digital processors, RF, and radio circuits as well as power control devices. Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages. Responsibilities include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem, Auto, Compute, Infrastructure and IOT.

The candidate is expected to have proficiency on Siemens/Mentor Xpedition, PADS and / or Cadence Allegro PWB design software and is expected to have experience in developing PWB design solutions for a variety of design types and working with internal teams and external suppliers to support PWB fabrication and assembly.

This Candidate will be expected to be onsite weekly for team and project collaboration.

Minimum Qualifications

• 8+ years actively involved in PWB design for high-density electronics packaging.
• 4+ years’ experience in a PWB design role designing consumer-grade mobile products or low volume test products utilizing latest generation processor chips & ICs.
• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.

Preferred Qualifications

• Knowledge of large/high density digital designs having high layer counts (24-34 layers) and containing several FPGA's (>1500 pins) along with very high-speed digital signals.
• Mastery in digital processors, RF and radio circuits as well as power control devices.
• Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .35 mm pitch and smaller packages.
• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.
• Preferred design experience: RF, Analog, High-speed digital circuits - DDR2, 3 & 4, LPDDR5, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE
• Able to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.
• Effectively multitasks and meets aggressive schedules in a dynamic environment.
• Determine PWB design trade-offs necessary to meet design requirements and produce high quality cost effective PWB’s that meet schedule objectives.
• Understands the requirements driving PWB technology and process trends and their application to client designs.
• Maintain technical coordination with Engineering and Manufacturing. Resolve PWB design issues with fabrication and assembly vendors.
• Participate and provide input into process improvement, PWB and DFM checklists and guidelines.
• Participates in determining objectives of assignment and plans, schedules, and arranges own activities in accomplishing objectives.
• Experience working with various EMI mitigation techniques and practices.
• Experience with IDF/EMN file exchange between mechanical and HW teams.
• Understands project goals and individual contribution toward those goals.
• Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
• Interact and collaborate with other internal PWB designers for optimal product development processes and schedule execution.
• Effectively multitasks and meets aggressive schedules in a dynamic environment.
• Prepare and deliver design reviews to project team.
• Possess excellent verbal and written communication skills
• Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.

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